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Qualcomm Snapdragon flaws impact Lenovo, Microsoft, Lenovo, and Samsung devices

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Tens of software vulnerabilities affected Qualcomm firmware and impacted the devices of Microsoft, Lenovo, and Samsung.

Qualcomm January 2023 security bulletin addressed 22 software vulnerabilities in its Snapdragon suite. Some of the flaws were reported by the efiXplorer Team at the firmware protection firm Binarly, Zinuo Han of OPPO Amber Security Lab, Gengjia Chen from IceSword Lab, the researchers nicolas (nicolas1993), Seonung Jang of STEALIEN, and Le Wu of Baidu Security.

Below are reported the most severe vulnerabilities addressed by the company:

Public ID Security Rating CVSS Rating Technology Area Date Reported
CVE-2022-33218 Critical High Automotive Internal
CVE-2022-33219 Critical Critical Automotive Internal
CVE-2022-33265 Critical High Powerline Communication Firmware Internal
CVE-2022-25725 High Medium UTILS Internal
CVE-2022-25746 High High KERNEL Internal
CVE-2022-33252 High High WLAN Firmware Internal
CVE-2022-33253 High High WLAN Firmware Internal
CVE-2022-33266 High Medium Audio Internal
CVE-2022-33274 High High Android Core Internal
CVE-2022-33276 High High WLAN Firmware Internal
CVE-2022-33283 High High WLAN Firmware Internal
CVE-2022-33284 High High WLAN Firmware Internal
CVE-2022-33285 High High WLAN Firmware Internal
CVE-2022-33286 High High WLAN Firmware Internal
CVE-2022-33290 High High Automotive Connectivity Internal
CVE-2022-33299 High High Automotive Connectivity Internal
CVE-2022-33300 High High Automotive Android OS Internal
CVE-2022-40516 High High Boot 10/28/2022
CVE-2022-40517 High High Boot 10/28/2022
CVE-2022-40520 High High Connectivity 10/28/2022

The most severe flaw is an integer overflow to buffer overflow in Automotive tracked as CVE-2022-33219 (CVSS Score 9.3).

“Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.” reads the advisory.

Other two severe issues fixed by Qualcomm are:

  • CVE-2022-33218 (CVSS Score 8.2) – the flaw is a Memory corruption in Automotive due to improper input validation.
  • CVE-2022-33265 (CVSS Score 7.3) – the flaw is an Information exposure in Powerline Communication Firmware.

The flaws impacted laptops and other devices using Snapdragon chipsets that are manufactured by Lenovo, Microsoft, and Samsung.

Lenovo released updates to address the vulnerabilities impacting the ThinkPad X13s BIOS.

Follow me on Twitter: @securityaffairs and Facebook and Mastodon

Pierluigi Paganini

(SecurityAffairs – hacking, Moshen Dragon)

The post Qualcomm Snapdragon flaws impact Lenovo, Microsoft, Lenovo, and Samsung devices appeared first on Security Affairs.


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